Inspection Solutions
SPI Line 3D is a new 3D Solder Paste Inspection System from Göpel Electronic that fulfils the future needs for effective process optimization combined with the required speed. The system gives you precise two and three-dimensional solder paste printing measurements.
Key parameters
- Camera head optimized for speed
- 180 images per second at 4-megapixel resolution
- Very precise 3D image capturing based on fringe projection technology
- Measurement head operating without moving parts
- Double-sided projection for 100% shadow-free measurement
- Intuitive software SPI-Pilot – program generation in less than 10 minutes
- Advanced coplanarity function for inspecting sintering paste
- Touchscreen interface
Effective process optimization
- Repeatable measuring
- Statistical process control (SPC)
- Closed loop to printer
- Link to AOI/AXI repair station
Standard measurement range
- X/Y offset
- Pad area
- Bridges (smearing)
- Volume
- Shape
- Height
Products
- Solder Paste Inspection (SPI)
- SPI Line 3D
- Automated Optical Inspection (AOI)
- Basic Line (Stand-alone AOI System)
- THT Line (In-line)
- Vario Line (In-line)
- MultiCam Line
- Automated X-Ray Inspection (AXI)
- X-line 3D
Product information
- Solder Paste Inspection (SPI)
- SPI Line 3D - 3D Solder Paste Inspection System
- Automated Optical Inspection (AOI)
- AOI for THT Manufacturing
- OpticonTHT-Line
- MultiCam Line
- New MultiEyes Camera for large THT Inspection
